Semiconductor device comprises ferrite structure formed between conductive pad and termination point

摘要

A semiconductor device comprises: a conductive pad (114) formed on a substrate (110); termination point (100) electrically connected to the pad; and ferrite structure (130) formed between the conductive pad and the termination point. An independent claim is also included for forming a semiconductor device, comprising: (A) forming a conductive pad on a substrate; (B) forming a termination point on the substrate; and (C) forming a ferrite structure between the conductive pad and the termination point.