WIRING BOARD, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of securing high connection reliability by restraining corrosion of a projected electrode caused by moisture at an interface between the protruded electrode of a portion formed in a region on an insulating base member on opposite sides of conductive wiring and the insulating base member.

SOLUTION: There are provided the insulated base member 1; a plurality of conductive wirings 2 provided in alignment on the insulating base member 1; protruded electrodes 3 each formed on the conductive wiring and formed over a region on the insulating base member 1, on opposite sides of the conductive wiring 2 traversing the conductive wiring 2 longitudinally of the same 2; and a metal plating layer 4 applied on the conductive wiring 2 and the protruded electrode 3, and consisting of a metal more unlikely to be ionized than the metal of the protruded electrode 3. A metal plating layer 4a is formed also on the interface between the protruded electrode 3 of a portion formed in a region on the insulating base member 1 on opposite sides of the conductive wiring 2 and the insulating base member 1.

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