| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board wherein, when subjecting to a dip soldering a lead wire inserted into its through-hole by using a lead-free solder, the finished state of the solder stuck to its through-hole can be improved, the bubbles generated in the solder can be suppressed, and further, its durability can be improved relative to its thermal fatigue. SOLUTION: The printed wiring board 1 has a through-hole 7 whereinto a lead wire 6 is so inserted as to be subjected to a dip soldering by using a lead-free solder, and the periphery of which a plurality of via holes 10 are provided. COPYRIGHT: (C)2007,JPO&INPIT |
