| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin precursor composition improving the adhesiveness of a film after heat curing to a metal material, especially copper, gold or a titanium metal with a slight change in adhesiveness performances during preservation at room temperature and to provide a semiconductor device using the composition. SOLUTION: The heat-resistant resin precursor composition is characterized as comprising (a) a polymer consisting essentially of a structural unit represented by general formula (1) (wherein, m<SB>1</SB>is an integer of 3-100,000; n and o are each an integer of 0-2; p and q are each an integer of 0-4; and n+q>0) and (b) a specific disulfide compound or a specified thioether compound. COPYRIGHT: (C)2007,JPO&INPIT
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