| 摘要 |
A substrate treating method for treating substrates with a treating solution including sulfuric acid and a hydrogen peroxide solution. The method includes a first preparing step for preparing dilute sulfuric acid of a predetermined concentration by mixing deionized water and sulfuric acid, a second preparing step for preparing the treating solution by mixing the dilute sulfuric acid prepared in the first preparing step and the hydrogen peroxide solution, and a treating step for treating the substrates, in a treating unit that holds the substrates, with the treating solution prepared in the second preparing step.
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