| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of reducing breakage of a bonding wire even in an environment having great temperature change or pressure actuation, and elongating a lifetime. <P>SOLUTION: This semiconductor pressure sensor includes a resin package 1 having a recessed part 1a; a lead 2 whose one end is exposed to the recessed part 1a and whose other end is drawn out to the outside of the package 1, integrated with the package 1 by insert molding; a sensor chip 3 provided on the recessed part 1a, for detecting the pressure; and the bonding wire 4 for connecting electrically the sensor chip 3 to the lead 2. In the sensor, the recessed part 1a side of the interface between the lead 2 and the package 1 is coated by the first insulating protection resin part 6, and the bonding wire 4 is coated by the second protection resin part 7 which is softer than the first protection resin part 6. <P>COPYRIGHT: (C)2007,JPO&INPIT |
