| 摘要 |
PROBLEM TO BE SOLVED: To provide a chuck top for a wafer prober which can improve throughput by improving a temperature increase speed of a prober and the soaking performance thereof, and a wafer prober device mounted with the same. SOLUTION: The chuck top for a wafer prober has a conductor layer on its surface, and has a heat generator on a portion other than the conductor layer. The maximum outer dimension l of a region where the heat generator is provided is smaller than the diameter L of the chuck top, and satisfies a relation of l+4t>Wl, where the thickness of the chuck top is t and the diameter of the wafer is W1. COPYRIGHT: (C)2007,JPO&INPIT |
