| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a thinned substrate with proper yield. SOLUTION: After a protective layer has been formed in a predetermined portion of a substrate (a portion covering at least the end face of the substrate), the substrate is ground and polished. More specifically, an element layer having a plurality of integrated circuits is formed on one surface of the substrate, a protective layer is formed in contact with at least the end face of the substrate, the substrate is made thin (by grinding and polishing the other surface of the substrate, for example), the protective layer is removed, and then the substrate and the element layer are segmented, thus forming a laminate having a layer provided with at least one of the plurality of integrated circuits. COPYRIGHT: (C)2007,JPO&INPIT |
