摘要 |
PROBLEM TO BE SOLVED: To provide technology for predicting the state of mounting of resin moldings to improve their "mounting quality". SOLUTION: The method for the prediction of the state of mounting of resin moldings predicts the state of mounting, when they are mounted on their supporting bodies. The method comprises: the first step in which the amounts of possible deformation occurring to the resin moldings (front bumper 1) when molded are predicted; the second step in which the amounts of possible thermal deformation occurring to the resin moldings by the influence of heat after the molding are predicted; the third step in which the amounts of deformation occurring at the time of mounting the resin moldings to the supporting bodies are predicted; and the fourth step in which the states of mounting on the supporting bodies are predicted from the amounts of the deformation on molding, the amounts of the thermal deformation and the amounts of the deformation on mounting. COPYRIGHT: (C)2007,JPO&INPIT
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