Multi-station workpiece processors, methods of processing semiconductor workpieces within multi-station workpiece processors, and methods of moving semiconductor workpieces within multi-station workpiece processors

摘要

The invention includes multi-station workpiece processors, methods of processing semiconductor workpieces within multi-station workpiece processors, and methods of moving semiconductor workpieces within multi-station workpiece processors. In one implementation, a multi-station workpiece processor includes a processing chamber comprising multiple stations for processing individual workpieces. A pedestal is associated with individual of the stations. The pedestals are mounted for selective vertical up movement within the chamber to contact a workpiece and for selective vertical down movement within the chamber to be displaced from a workpiece. The pedestals respectively comprise an upper surface upon which an individual workpiece is received during processing within the chamber. At least one workpiece engagement arm is associated with individual of the pedestals. The workpiece engagement arms are movable between a position received at least partially over individual of the pedestals and a position displaced away from over all of the pedestals. Other aspects are contemplated.