发明名称 |
Methods and apparatus for selectively removing conductive material from a microelectronic substrate |
摘要 |
Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.
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申请公布号 |
US2007037490(A1) |
申请公布日期 |
2007.02.15 |
申请号 |
US20060585740 |
申请日期 |
2006.10.23 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
LEE WHONCHEE;MOORE SCOTT E.;MEIKLE SCOTT G. |
分类号 |
B24B1/00;B23H5/08;B24B7/19;B24B49/00;B24B51/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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