发明名称 Wiring circuit board
摘要 A wiring circuit board at least contains an electric insulator layer and an electric conductor formed on the electric insulator layer so as to form a predetermined circuit pattern, which further comprises an adhesive layer formed by thermal hardening of the thermosetting adhesive and pressure-sensitive adhesive composition as described in the specification.
申请公布号 US2007036954(A1) 申请公布日期 2007.02.15
申请号 US20060502386 申请日期 2006.08.11
申请人 NITTO DENKO CORPORATION 发明人 IKISHIMA MIYOKO;OOURA MASAHIRO
分类号 B32B3/00;H05K1/02 主分类号 B32B3/00
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