发明名称 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
摘要 A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a connection terminal provided on or above the active face of the semiconductor substrate.
申请公布号 US2007035000(A1) 申请公布日期 2007.02.15
申请号 US20060500264 申请日期 2006.08.07
申请人 SEIKO EPSON CORPORATION 发明人 HASHIMOTO NOBUAKI
分类号 H01L23/02;H01L21/44 主分类号 H01L23/02
代理机构 代理人
主权项
地址