Bondverfahren für eine integrierte Schaltung

摘要

An integrated circuit is formed in a chip of semiconductor material (115) fixed on a supporting pad (120) on a heat sink (125) in an insulating plastic casing (105). Aluminum conducting pads (130) within an insulating layer (127) are connected electrically to the chip. Aluminum or gold conducting wires (140) are connected between a nickel bump (135) on each conducting pad and a corresponding terminal (110) and each conducting wire is covered with a layer of copper (145). An independent claim is also included for an electronic device comprising an integrated circuit including connecting wires between pads and terminals covered by a conducting material.