| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a fine structure capable of compensating dispersion in a manufacturing stage by using a test result by a tester, its manufacturing method, its manufacturing method program, and a semiconductor manufacturing apparatus. <P>SOLUTION: In the tester 1, a test sound wave is input, and an output voltage from a device in response to input of the test sound wave is detected. A bonder 60 receives a test result by the tester 1, executes classification of the device, and executes bonding and adjust to acquire an amplification factor of an amplifier corresponding to a classified group. <P>COPYRIGHT: (C)2007,JPO&INPIT |
