| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that gives a cured product excellent in both ultraviolet resistance and heat resistance, and a light-emitting diode comprising the composition as a sealing material. <P>SOLUTION: The thermosetting resin composition comprises triglycidyl cyclohexane-1,2,4-tricarboxylate as well as hydrogenated trimellitic anhydride and no special curing accelerator. The light-emitting diode comprises the composition as the sealing material. <P>COPYRIGHT: (C)2007,JPO&INPIT |
