| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact and thin liquid-cooling circuit board with a heat sink suitable for a double-sided mounting substrate or a hierarchical structure circuit board. SOLUTION: The circuit board with a heat sink includes a first circuit board having electronic components mounted on both faces, a pipe provided in a predetermined pattern on a front face of the first circuit board, and a thermally conductive block provided along the pipe. The first circuit board has a plurality of through-holes along the pattern, and part of the block is exposed to the rear face of the first circuit board. The problem is thus solved by the circuit board with the heat sink or the like. COPYRIGHT: (C)2007,JPO&INPIT
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