| 发明名称 |
Modular aufgebautes Leistungshalbleitermodul |
| 摘要 |
<p>A surface-mounted power semiconductor module (1) comprises many part modules (10) on a base (20) with a housing and load and auxiliary connections. Within each housing is an isolating substrate (5) having mutually isolated though leads to the semiconductor elements and a cover fixes the part modules to one another.</p> |
| 申请公布号 |
DE502004002495(D1) |
申请公布日期 |
2007.02.15 |
| 申请号 |
DE20045002495T |
申请日期 |
2004.03.13 |
| 申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
MANZ, YVONNE;WAHI, ASEEM;GRUBER, MARKUS |
| 分类号 |
H01L25/07;H01L25/11;H01L25/18 |
主分类号 |
H01L25/07 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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