| 摘要 |
<P>PROBLEM TO BE SOLVED: To acquire reliability of connection of three-dimensional mounting in laminate semiconductor device and the mounter thereof, even when warpage is caused in a semiconductor package forming the semiconductor device. <P>SOLUTION: In the laminate semiconductor device, a first semiconductor package 1 and a second semiconductor package 11 are joined via a metal ball 21, and a plurality of electrode lands 5, 19 corresponding to each other are formed at the opposing areas where the first semiconductor package 1 and the second semiconductor package 11 are provided opposed with each other. The heights of a plurality of electrode lands 5 are different from each other in at least one opposing surface. Since the height of the electrode land 5 is different, the grounding area can be acquired where the metal ball 21 is joined, reliability of connection of the three-dimensional mounting can be assured even when warpage is caused in the package, and thereby manufacturing yield can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
