| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip type electronic component prevented from the generation of burrs formed by effecting the dicing of a section of an electrode in the chip type electronic component, by a method wherein a bar type substrate is formed by applying a first dicing on a large-size substrate provided with electrodes respectively on respective electronic component forming regions and, thereafter, the chip type electronic component is formed by applying a second dicing on the bar-type substrate. <P>SOLUTION: The electrode 14 is provided so as to be remote by a predetermined space from the region to be diced on the large-size substrate 10 cut by the first dicing. Especially, the electrode 14 is arranged so as to be remote from a cutting end rim formed by applying the first dicing on the region to be diced. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
