| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate excellent in component mounting performance and having a small circuit level-difference of the outermost layer pattern, and to provide a method of manufacturing the same. <P>SOLUTION: In the manufacturing step (A) of the multilayer wiring substrate, a base material for the multilayer wiring substrate and an outermost layer base material having a conductive layer without a wiring pattern are prepared. The base material for the multilayer wiring substrate is provided with a conductive layer, which forms a wiring pattern, on one face of an insulating base material and a via hole penetrating the insulating base material and the conductive layer. In the step (B), a laminate is formed by sticking one or more base materials for the multilayer wiring substrate and the outermost layer base material between their base materials through an interlayer adhesive layer, so that the outermost layer base material is arranged to the outermost side. In the step (C) subsequently, a metal layer is formed on the conductive layer of the outermost layer base material. In the step (D), an outermost layer pattern is formed on the conductive layer and the metal layer of the outermost layer base material. In the step (E), before or after the (D) step, planarization process is executed so as to make the circuit level difference of the outermost layer pattern below 10μm. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
