| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper-free plated film on a resin, which does not cause blistering therein due to corrosion regardless of a thickness of an electrolytically plated nickel film, and shows adequate appearance and improved corrosion resistance even when a bright-nickel-plated film for leveling (smoothing flaw or unevenness of a plated material) is thinner than that in a process of using electroless nickel plating for the pretreatment, by changing the pretreatment for copper-free plating from electroless nickel plating to direct plating. <P>SOLUTION: The method for improving the corrosion resistance of the copper-free plated film on a resin includes electroplating a resin-molded article while skipping a copper plating step, and subjects the resin-molded article to each treatment of: etching S1; etching neutralization S2; catalyst application S3; and conductivity impartation S4; electrolytic nickel plating; and finally chromium plating S8. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
