发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To achieve size reduction and manufacturing-cost reduction of a heat sink, while enhancing heat-dissipation performance by making the air flow smooth. SOLUTION: The heat sink 1 is provided with a heat-receiving plate 2 mountable to a heat source, heat dissipating sections 3, 21 provided on the heat-receiving plate 2, and a cooling fan 4 provided so as to be capable of sending cooling air to the heat dissipating sections 3, 21. The heat dissipators 3, 21 are respectively provided with heat transfer plates 5, 22 erected on the heat-receiving plate 2, at a prescribed interval and heat-dissipating fins 6, 24 vertically interposed between the respective heat transfer plates 5, 22. Spaces 7 for sucking/exhausting the cooling air are formed between the lower end of the heat-dissipating fin 6 and the heat-receiving plate 2. Similarly, spaces 27 for sucking/exhausting the cooling air are formed between the lower end 26 of the heat-dissipating fin 24 and the heat-receiving plate 2. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007042724(A) 申请公布日期 2007.02.15
申请号 JP20050222681 申请日期 2005.08.01
申请人 T RAD CO LTD 发明人 NAKANO KIMIAKI;HORIUCHI TOSHIYUKI
分类号 H01L23/467;H05K7/20 主分类号 H01L23/467
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