| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated circuit board with high connection reliability, in which voids or cracks do not occur in an interface of copper foil and conductive paste comprising a low melting point metal in the laminated circuit board using conductive paste comprising the low melting point metal. SOLUTION: Conductive paste comprising the low melting point metal is arranged on a roughening processing layer of roughening processing copper foil where the roughening processing layer formed of a projection whose average coating weight is 150 mg/dm<SP>2</SP>or below and whose surface roughness is 0.3 to 10μm is formed on original foil whose surface roughness of at least one face of copper foil or copper alloy foil is 0.1 to 5μm. Surface processing copper foil is laminated with a resin substrate. COPYRIGHT: (C)2007,JPO&INPIT
|
