| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible substrate which has mechanical strength that can be utilized as a self-supporting film, has high heat resistance, has superior flexibility, can easily be laminated by overlapping the film itself and has high electrical insulation. SOLUTION: The flexible substrate is composed mainly of clay and has a structure of a single layer or multiple layers. The flexible substrate is formed of only clay, or clay and a small amount of additive, or clay and a small amount of reinforcing materials, or clay and a small amount of additive and the small amount of the reinforcing materials. An electronic circuit is formed on the flexible substrate by a conductor. Thus, the flexible substrate, consisting of a clay thin film substrate whose heat resistance is improved, can be supplied. COPYRIGHT: (C)2007,JPO&INPIT
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