| 摘要 |
PROBLEM TO BE SOLVED: To hardly cause a short circuit and breaking even if moisture in an external atmosphere is infiltrated into an anisotropic conductive adhesive in a mounting structure of a semiconductor apparatus using an anisotropic conductive adhesive. SOLUTION: The anisotropic conductive adhesive 21 is obtained by dispersing a conductive particle 23 and a water-absorbing particle 24 into an insulating adhesive 22. Moisture infiltrated into the anisotropic conductive adhesive 21 is absorbed in the water-absorbing particle 24 and a short circuit and breaking of the wiring 12 of a circuit board 11 caused by moisture hardly occur. COPYRIGHT: (C)2007,JPO&INPIT
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