INCLUSION COMPOUND, CURING CATALYST, CURED RESIN-FORMING COMPOSITION AND CURED RESIN

摘要

PROBLEM TO BE SOLVED: To provide a curing catalyst (inclusion compound) effectively curing resins with enhancing one component liquid stability by suppressing a curing reaction at low temperature and applying heat treatment. SOLUTION: The inclusion compound comprises at least an isophthalic acid compound and an imidazole compound expressed by formula (II) [wherein R2expresses H, a 1-10C alkyl, phenyl, benzyl or cyanoethyl; R3to R5express each H, nitro, a halogen atom, a 1-20C alkyl, phenyl, benzyl or a 1-20C acyl]. COPYRIGHT: (C)2007,JPO&INPIT