| 摘要 |
On both surfaces of an electric insulating material 1 , a surface conductive layer 2 A and a back surface conductive layer 2 B are formed by transcription. Further, a via hole 5 penetrating through the surface conductive layer 2 A and the electric insulating material 1 is provided. After forming a photosensitive plating resist pattern 14 , the via hole 5 is filled with a copper plating filler 15 , and the surface wiring layer 9 A and the back surface wiring layer 9 B are formed. Thereafter, the photosensitive plating resist pattern 14 as well as the surface conductive layer 2 A and the back surface conductive layer 2 B provided under the photosensitive plating resist pattern 14 are removed to fabricate a double-sided wiring board 11.
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