发明名称 |
SHEET APPLICATION DEVICE AND APPLICATION METHOD |
摘要 |
<p>A wafer (W) is supported on each inner table (52) of a table (13). After a band-like sheet (S) is paid out on to the upper surface side of the wafers (W), pressing force is applied to the sheet by a pressing roller (14). The adhesion sheet (S) is cut along wafer outer edges by a cutter blade (63) installed on the free end side of a robot (15). The robot (15) has a function of passing the cutter blade (63) to a suction arm (100) and conveying wafers (W) from a magazine (200) to the table (13) and a function of transferring wafers (W), to which the sheet has been applied, to a post process.</p> |
申请公布号 |
WO2007018041(A1) |
申请公布日期 |
2007.02.15 |
申请号 |
WO2006JP314852 |
申请日期 |
2006.07.27 |
申请人 |
LINTEC CORPORATION;NONAKA, HIDEAKI;KOBAYASHI, KENJI |
发明人 |
NONAKA, HIDEAKI;KOBAYASHI, KENJI |
分类号 |
H01L21/683;H01L21/52 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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