SEMICONDUCTOR CHIP PACKAGE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a miniaturized semiconductor chip package and its manufacturing method.

SOLUTION: The semiconductor chip package 1 comprises a first semiconductor chip 10 having a movable structure containing a movable part, a plurality of first electrode pads 18, a closed circular first sealing part 20 provided on the top surface of a frame while surrounding the movable structure and a thin plate-like member 30 sealing the movable structure; a second semiconductor chip 50 having a plurality of second electrode pads 52; a substrate 40 which has a third electrode pad 42 and is mounted with the first semiconductor chip 10 and the second semiconductor chip 50; a first bonding wire 62a connecting the second electrode pad 52 to the third electrode pad 42; and a second bonding wire 62b connecting the firs electrode pad 18 to the second electrode pad 52.

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