| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module which can be manufactured at a low cost. <P>SOLUTION: The power module 5F comprises a power semiconductor 53a, a non-power semiconductor 53b, a sheet of resin substrate 51F, and a cooling jacket 58F. The power semiconductor and the non-power semiconductor constitute a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling jacket has a first plate part and a second plate part. The second plate part is so protruded toward the resin substrate side than the first plate part along a plate thickness direction of the first plate part as to contact to at least the rear side surface of a mounting surface for the power semiconductor out of the resin substrate, and a cooling fluid channel 59 is provided inside the second plate part. <P>COPYRIGHT: (C)2007,JPO&INPIT |
