SUB-MOUNT AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a sub-mount for mounting an LED element for effectively condensing the light from the LED element, realizing sub-mount having excellent heat radiating property, and manufacturing many sub-mounts at a time under the wafer condition.

SOLUTION: An Si substrate (wafer) 4 having a pattern of through-hole 12 forming a sloping surface in the depthwise direction is joined with a glass substrate (wafer) 1 forming a pattern of through-hole electrode 2. An LED element 6A is mounted to the through-hole electrode 2 of the glass substrate 1. The mounting part of the LED element 6A is surrounded by a sloping surface (reflecting film 5 formed at the wall surface of through-hole 12) for reflecting and condensing the light emitted from the LED. Since the processes can be conducted at a time under the wafer condition, low price sub-mounts can be manufactured in large quantity.

COPYRIGHT: (C)2007,JPO&INPIT