| 摘要 |
PROBLEM TO BE SOLVED: To achieve an improvement in heat dissipation, a reduction in package size, and element protection. SOLUTION: In a method of manufacturing a semiconductor light-emitting device provided with a groove in a metallic heat sink section having a depth for storing a semiconductor light-emitting element, in which the semiconductor light-emitting element and one end of a lead pin for performing wire bond connection with the element are disposed in the groove, the wire bond connection to the one end of the lead pin disposed within the groove is performed within the groove. COPYRIGHT: (C)2007,JPO&INPIT
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