发明名称 |
LIQUID PHASE DIFFUSION BONDING OF DISSIMILAR METALS |
摘要 |
PROBLEM TO BE SOLVED: To provide improved liquid phase diffusion bonding of dissimilar metals, more particularly, of copper or a copper alloy to a non-copper alloy. SOLUTION: In the method for forming a component, a braze material is assembled between first and second wall portions to form a sandwich. The first wall portion consists essentially of copper or a copper-based alloy. The second wall portion comprises at least one non-copper-based alloy. The sandwich is heated. The heating melts the braze material to cause a liquid phase diffusion bonding of at least a portion of the first wall portion to the second wall portion. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007038298(A) |
申请公布日期 |
2007.02.15 |
申请号 |
JP20060205496 |
申请日期 |
2006.07.28 |
申请人 |
UNITED TECHNOL CORP <UTC> |
发明人 |
WATKINS WILLIAM B;BARONE JOSEPH C |
分类号 |
B23K20/00;B23K20/14;B23K20/22;B23K20/24;B23K35/30;B23K101/14;B23K103/22;C22C19/03;C22C19/05;F02K9/62;F28F3/08;F28F21/08 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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