| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive composition that has a minute structure, such as a conventional high-temperature baking type conductive paste, even in low-temperature baking at 150°C or smaller and can form a conductive film having a low specific resistance equivalent to that of metal silver, to provide the conductive film having a minute structure, and to provide a method for forming the conductive film. SOLUTION: The conductive composition is a mixture of a particulate silver oxide having a particle diameter of 0.01-10μm and a silver nano particle whose particle diameter is less than 10 nm while containing dispersant having a functional group with reduction capability to the silver oxide, and contains a particulate metal filler whose particle diameter ranges from 0.01-10μm (Au, Ag, Cu, Pt, Pd) as needed. In the conductive paste, the dispersant, resin, and a solvent are mixed to the conductive composition. The conductive film has a minute structure obtained by coating an object with the conductive paste for heating. COPYRIGHT: (C)2007,JPO&INPIT
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