| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin and a composition thereof which give cured product having excellent flame retardancy and high adhesion to a material of a different kind and is desirable as a material for electronic component sealing, a circuit board material, or the like. SOLUTION: The epoxy resin is represented by formula (1) (wherein R<SB>1</SB>and R<SB>2</SB>are each a hydrogen atom, a halogen atom, or a 1 to 7C hydrocarbon group; G is a glycidyl group; and n is an integer of 0 to 50). This epoxy resin is obtained by reacting a bis(dihydroxyphenyl) disulfoxide with epichlorohydrin. The epoxy resin composition essentially consists of the epoxy resin and a curing agent. The cured product is obtained by curing the epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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