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发明名称
THERMOSETTING ADHESIVE AND PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMOSETTING ADHESIVE AND PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET, AND WIRING CIRCUIT BOARD
摘要
申请公布号
KR20070019591(A)
申请公布日期
2007.02.15
申请号
KR20060075803
申请日期
2006.08.10
申请人
发明人
分类号
C09D133/06;C09D133/08;C09D161/12
主分类号
C09D133/06
代理机构
代理人
主权项
地址
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