发明名称 Manufacturing method and structure of PCB, and socket assembly for memory module assembly
摘要 <p>Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.</p>
申请公布号 KR20070019476(A) 申请公布日期 2007.02.15
申请号 KR20050074480 申请日期 2005.08.12
申请人 发明人
分类号 H01L23/50 主分类号 H01L23/50
代理机构 代理人
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