| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize conductive connection between a silicon substrate and a solder ball without through a bonding process, when manufacturing a semiconductor device called BGA for example. <P>SOLUTION: Onto a bonding layer 22 on a base plate 21 of a size dealing with a plurality of semiconductor devices, semiconductor elements 23 formed by providing a rewiring 32, a columnar electrode 33 and a sealing film 34 on a silicon substrate 24 are arranged. The upper surface of the sealing film 34 of the semiconductor element is positioned on the same plane as the upper surface of the columnar electrode 33. Then a sealing film 35 is formed on a peripheral side surface of the semiconductor element 23. Then a first upper insulation film 36, a first upper rewiring 39, a second upper insulation film 41, a second upper rewiring 44, and a third upper insulation film 45 are laminated in this order. At the last, the solder ball 47 is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
