| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity and excellent in flame retardancy, flexibility, adhesion, pencil hardness, solvent, acid and heat resistances and gold plating resistance after curing, and a cured product of the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition soluble in an alkaline aqueous solution contains a resin (A) soluble in an alkaline aqueous solution obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by formula (1) (wherein n denotes a positive number of 1-10 on an average) and an unsaturated monocarboxylic acid (b), an epoxy resin (a') represented by the formula (1) as a curing agent (B), and a photopolymerization initiator. <P>COPYRIGHT: (C)2007,JPO&INPIT |
