| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach film for attaching a film, which functions as a die bonding adhesive, a die attach film, and a dicing film, onto a wafer under mild climate condition of 60°C or below in a fabrication step of a semiconductor. SOLUTION: Peel strength of a wafer and a film-shaped adhesive is 50 g/25 mm or more when the film-shaped adhesive is attached to the rear face of the wafer at a temperature of 60°C, and preferably glass transition temperature of constituting resin composite is not less than -30°C and not more than 60°C. The resin composite is a die bonding film-shaped adhesive containing epoxy resin and acrylic acid copolymer with glass transition temperature not less than -30°C and not more than 60°C. In addition, by using a transparent substrate, a die attach film with a dicing sheet function can be manufactured. COPYRIGHT: (C)2007,JPO&INPIT |
