| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving reliability and durability. <P>SOLUTION: A rectifying element 55 as the semiconductor device includes a disk 500, solder 511, a shock-absorbing plate 516, solder 512, a semiconductor chip 510, solder 513, a lead 520 and a sealing material 522. The disk 500 is of a cylindrical form having a recess 504 formed at one of ends, and has an angle formed between a joining surface 506 as a bottom of the recess 504 and a sidewall 508 specified to be larger than 90 degrees, to cause the sidewall 508 to be inclined. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
