| 摘要 |
PROBLEM TO BE SOLVED: To provide a slim, thin and long integrated circuit device, and electronic equipment including the same. SOLUTION: The integrated circuit device 10 includes first and second transistors NTr1 and PTr1 push-pull connected between first and second power supply lines and outputting a voltage of either of the first and second power supply lines to a connection node ND by a charge-pump operation; and a pad PD electrically connected with the connection node ND and electrically connected with a flying capacitor, to which a given voltage is applied at one end, at the other end of the flying capacitor. The pad PD is arranged on an upper layer of at least one of the first and second transistors NTr1 and PTr1 so that the pad PD overlaps one part or the entire part of at least one of the first and second transistors NTr1 and PTr1. COPYRIGHT: (C)2007,JPO&INPIT
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