发明名称 |
Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system |
摘要 |
The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate with a deposition shield coupled to the upper electrode advantageously provides gas injection of a process gas with substantially minimal erosion of the upper electrode while providing protection to a chamber interior.
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申请公布号 |
US2007034337(A1) |
申请公布日期 |
2007.02.15 |
申请号 |
US20060584525 |
申请日期 |
2006.10.23 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
NISHIMOTO SHINYA;MITSUHASHI KOUJI;NAKAYAMA HIROYUKI |
分类号 |
C23F1/00;B05D1/08;C23C16/00;C23C16/44;H01J37/32 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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