发明名称 Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
摘要 The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate with a deposition shield coupled to the upper electrode advantageously provides gas injection of a process gas with substantially minimal erosion of the upper electrode while providing protection to a chamber interior.
申请公布号 US2007034337(A1) 申请公布日期 2007.02.15
申请号 US20060584525 申请日期 2006.10.23
申请人 TOKYO ELECTRON LIMITED 发明人 NISHIMOTO SHINYA;MITSUHASHI KOUJI;NAKAYAMA HIROYUKI
分类号 C23F1/00;B05D1/08;C23C16/00;C23C16/44;H01J37/32 主分类号 C23F1/00
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