Fluid-ejecting integrated circuit utilizing electromagnetic displacement

摘要

A fluid ejecting integrated circuit includes a wafer substrate. A drive circuitry layer is positioned on the wafer substrate. A protective passivation layer is positioned on the drive circuitry layer. A nozzle chamber wall extends from the passivation layer and a roof wall is positioned on the nozzle chamber wall such that the nozzle chamber wall and the roof wall define a nozzle chamber and a fluid ejection port in fluid communication with the nozzle chamber. A fluid ejecting member overlies the passivation layer within the nozzle chamber and is configured to be displaced to eject fluid through the fluid ejection port. A pair of spaced apart electrodes is connected to the drive circuitry layer so that the drive circuitry layer can create a potential difference between the electrodes, with one of the electrodes fast with the fluid ejecting member to displace the fluid ejecting member as a result of the potential difference.