| 摘要 |
A photosensitive device has packaging elements, a sensor chip and a light-filtering layer. The packaging elements include encapsulant to cover, environmentally seal and protects the photosensitive device against damage from external contaminants and moisture. The sensor chip has a top and a photosensitive area formed on the top. The light-filtering layer filters light that emits on the photosensitive area of the sensor chip to achieve a desired photosensitive response and is mounted to the photosensitive area with a transparent adhesive layer.
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