ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME

摘要

Disclosed is an adhesive film containing a polyimide resin (A) and a thermosetting resin (B), which is characterized in that the polyimide resin (A) contains a polyimide resin having a repeating unit represented by the formula (I) below and the storage modulus at 250°C after being heat treated at 150-230°C for 0.3-5 hours is not less than 0.2 MPa. (I) (In the formula, m-number of R¹'s independently represent a divalent organic group and k-number of organic groups selected from -CH₂-, -CHR- and -CR₂- (wherein R represents a non-cyclic alkyl group having 1-5 carbon atoms) are included in total in the m-number of R¹'s; m is an integer of not less than 8, and m and k satisfy the relation of k/m = 0.85; and R² represents a residue of a tetracarboxylic acid.)