| 摘要 |
PROBLEM TO BE SOLVED: To control, in an increase of a Pb composition ratio due to adhesion of revaporized Pb from a deposition film on an adhesion prevention plate to a PZT film deposited on a substrate by sputtering, the Pb composition ratio in the foregoing deposition. SOLUTION: There is provided in a chamber of a sputtering apparatus a lower adhesion prevention plate fixed to a bottom wall via an insulator covering a pedestal side surface, and a chamber bottom wall on which a support table for placing the substrate is mounted, below the surface of the substrate. The lower adhesion prevention plate is made applicable in electric potential. The Pb composition ratio in the deposited PZT is controlled by controlling the applied electric potential. COPYRIGHT: (C)2007,JPO&INPIT
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