发明名称 PLCC package with integrated lens and method for making the package
摘要 A plastic leaded chip carrier (PLCC) package includes an encapsulant having a domed portion, which is formed as an integral single piece structure. The encapsulant may be formed using an injection molding process. Another injection molding process may be used to form a structural body of the PLCC package.
申请公布号 US2007034886(A1) 申请公布日期 2007.02.15
申请号 US20050201503 申请日期 2005.08.11
申请人 WONG BOON S;ANG BEE K;LYE CHIEN C 发明人 WONG BOON S.;ANG BEE K.;LYE CHIEN C.
分类号 H01L21/00;H01L33/48;H01L33/52;H01L33/54 主分类号 H01L21/00
代理机构 代理人
主权项
地址