发明名称 |
PLCC package with integrated lens and method for making the package |
摘要 |
A plastic leaded chip carrier (PLCC) package includes an encapsulant having a domed portion, which is formed as an integral single piece structure. The encapsulant may be formed using an injection molding process. Another injection molding process may be used to form a structural body of the PLCC package.
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申请公布号 |
US2007034886(A1) |
申请公布日期 |
2007.02.15 |
申请号 |
US20050201503 |
申请日期 |
2005.08.11 |
申请人 |
WONG BOON S;ANG BEE K;LYE CHIEN C |
发明人 |
WONG BOON S.;ANG BEE K.;LYE CHIEN C. |
分类号 |
H01L21/00;H01L33/48;H01L33/52;H01L33/54 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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