MOLDED MICROMECHANICAL FORCE/PRESSURE TRANSDUCER, AND CORRESPONDING PRODUCTION METHOD

摘要

Disclosed is a force/pressure transducer and a method for the production thereof, which are based on a pressure sensor chip that is made from a semiconductor substrate and is produced by means of standard surface micromechanical processes. Said semiconductor substrate comprises a membrane above a closed (vacuum) cavity, which has a height of several micrometers, for example. In order to create the inventive force/pressure transducer, the pressure sensor chip is largely surrounded by a molding compound. This can be done in a mold, for example, the molding compound forming a housing around the pressure sensor chip and being equipped with adequate electrical terminals. In addition, the pressure sensor chip can also be introduced into a finished housing and can be fixed by means of the molding compound. The decisive aspect lies in the fact that the inventive molding compound forms a characteristic top part of a housing above the membrane, said top part being movable to a certain extent and being provided with a force shunt to the membrane.